Part Number Hot Search : 
D85C220 2500T 170M1319 350CA BFR520 05486 SM240 DSS12
Product Description
Full Text Search
 

To Download HD74LS247FPEL Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 HD74LS247
BCD-to-Seven-Segment Decoder / Driver (with three-state outputs)
REJ03D0465-0300 Rev.3.00 Jul.15.2005 The HD74LS247 is electrically and functionally identical to the HD74LS47, respectively, and has the same pin assignments as its equivalents. It can be used interchangeably in present or future designs to offer designers a choice between two indicator fonts. The HD74LS47 composes the 6 and the 9 without tails and the HD74LS247 composes the 6 and the 9 with tails. Composition of all other characters, including display patterns for BCD inputs above nine, is identical. The HD74LS247 features active-low outputs designed for driving indicators directly. All of the circuits have full rippleblanking input / output controls and a lamp test input. Segment identification and resultant displays are shown below. Display patterns for BCD input conditions. This circuit incorporates automatic leading and / or trailing-edge zero-blanking control (RBI and RBO). Lamp test (LT) of this type may be performed at any time when the BI / RBO node is at a high level. This type contains an overriding blanking input (BI) which can be used to control the lamp intensity be pulsing or to inhibit the outputs.
Features
* Ordering Information
Part Name HD74LS247P HD74LS247FPEL HD74LS247RPEL Package Type DILP-16 pin SOP-16 pin (JEITA) SOP-16 pin (JEDEC) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) PRSP0016DG-A (FP-16DNV) Package Abbreviation P FP RP Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel) EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Rev.3.00, Jul.15.2005, page 1 of 7
HD74LS247
Pin Arrangement
B Inputs C LT BI/RBO RBI D Inputs A GND
1 2 3 4 5 6 7 8 B C LT BI/BRO RBI D A f g a b c d e
16 15 14 13 12 11 10 9
VCC f g a b c d e Outputs
(Top view)
Function Table
Decimal or Function Inputs LT RBI D C B A BI/ RBO Outputs a b c d e f g Note
0 H H L L L L H ON ON ON ON ON ON OFF 1 H X L L L H H OFF ON ON OFF OFF OFF OFF 2 H X L L H L H ON ON OFF ON ON OFF ON 3 H X L L H H H ON ON ON ON OFF OFF ON 4 H X L H L L H OFF ON ON OFF OFF ON ON 5 H X L H L H H ON OFF ON ON OFF ON ON 6 H X L H H L H ON OFF ON ON ON ON ON 7 H X L H H H H ON ON ON OFF OFF OFF OFF 1 8 H X H L L L H ON ON ON ON ON ON ON 9 H X H L L H H ON ON ON ON OFF ON ON 10 H X H L H L H OFF OFF OFF ON ON OFF ON 11 H X H L H H H OFF OFF ON ON OFF OFF ON 12 H X H H L L H OFF ON OFF OFF OFF ON ON 13 H X H H L H H ON OFF OFF ON OFF ON ON 14 H X H H H L H OFF OFF OFF ON ON ON ON 15 H X H H H H H OFF OFF OFF OFF OFF OFF OFF BI X X X X X X L OFF OFF OFF OFF OFF OFF OFF 2 RBI H L L L L L L OFF OFF OFF OFF OFF OFF OFF 3 LT L X X X X X H ON ON ON ON ON ON ON 4 H; high level, L; low level, X; irrelevant Notes: 1. The blanking input (BI) must be open or held at a high logic level when output functions 0 through 15 are desired. The ripple-blanking input (RBI) must be open or high if blanking of a decimal zero is not desired. 2. When a low logic level is applied directly to the blanking input (BI), all segment outputs are off regardless of the level of any other input. 3. When ripple-blanking input (RBI) and inputs A, B, C, and D are a low level with the lamp test input high, all segment outputs go off and the ripple-blanking output (RBO) goes to a low level (response condition). 4. When a blanking input ripple blanking input (BI/RBO) is open or held high and a low is applied to the lamptest input, all segment outputs are on.
Rev.3.00, Jul.15.2005, page 2 of 7
HD74LS247
Block Diagram
a A b
B Inputs C
c
D d BI/BRO Blanking Input or Ripple Blanking Output
Outputs
e
f Lamp Test Input RBI Ripple Blanking Input g
Absolute Maximum Ratings
Item Supply voltage Input voltage Output current (tw 1ms, duty cycle 10%) Output current (off-state) Operating temperature Power dissipation Storage temperature Symbol VCC VIN IO (peak) IO (off) Topr PT Tstg Ratings 7 7 200 1 -20 to +75 400 -65 to +150 Unit V V mA mA C mW C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Rev.3.00, Jul.15.2005, page 3 of 7
HD74LS247
Recommended Operating Conditions
Item Supply voltage Operating temperature Output voltage Output current a to g a to g BI / RBO BI / RBO Symbol VCC Topr VO (off) IO (on) IOH IOL Min 4.75 -20 -- -- -- -- Typ 5.00 25 -- -- -- -- Max 5.25 75 15 24 -50 3.2 Unit V C V mA A mA
a f e d g b c
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Electrical Characteristics
(Ta = -20 to +75 C)
Item Input voltage BI/RBO BI/RBO a to g a to g Symbol VIH VIL VOH VOL IO (off) VO (on) IIH Input current Except BI/RBO BI/RBI IIL II min. 2.0 -- 2.4 -- -- -- -- -- -- -- -- -- typ.* -- -- -- -- -- -- -- -- -- -- -- -- max. -- 0.8 -- 0.4 0.5 250 0.4 0.5 20 -0.4 -1.2 0.1 Unit V V V V A V A mA mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = -50 A IOL = 1.6 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 3.2 mA VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V, VO (off) = 15 V IO (on) = 12 mA VCC = 5.25 V, VIH = 2 V, IO (on) = 24 mA VIL = 0.8 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = -18 mA Condition
Output voltage Output current Output voltage
Short-circuit BI/RBO IOS -0.3 -- -2 mA output current Supply current** ICC -- 7 13 mA Input clamp voltage VIK -- -- -1.5 V Notes: * VCC = 5 V, Ta = 25C ** ICC is measured with all outputs open and all inputs at 4.5 V.
Switching Characteristics
(VCC = 5 V, Ta = 25C)
Item Turn-on time Turn-off time Symbol ton toff Input A RBI A RBI min. -- -- -- -- typ. -- -- -- -- max. 100 100 100 100 Unit ns CL = 15 pF, RL = 665 ns Condition
Rev.3.00, Jul.15.2005, page 4 of 7
HD74LS247
Testing Method
Test Circuit
VCC 4.5V
RL a A B C D LT RBI BI/RBO b c d e f g CL
See Testing Table
Input P.G. Zout = 50
Output
Note:
CL includes probe and jig capacitance.
Testing Table
Item RBI 4.5V 4.5V 4.5V IN D GND GND GND GND Inputs C GND GND 4.5V GND B GND 4.5V 4.5V GND A IN IN IN GND a OUT -- -- OUT b -- -- OUT OUT c -- OUT -- OUT Outputs d OUT -- OUT OUT e OUT OUT OUT OUT f OUT -- OUT OUT g -- -- OUT --
ton toff
Waveform
tTLH 90% 1.3 V 10% toff tTHL 90% 1.3 V 10% ton VOH In phase output ton 1.3 V toff VOH Out of phase output 1.3 V 1.3 V VOL 1.3 V VOL 3V 0V
Input
Note:
Input pulse; tTLH 15 ns, tTHL 6 ns, PRR = 1 MHz, duty cycle = 50%
Rev.3.00, Jul.15.2005, page 5 of 7
HD74LS247
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
E
A1
A
Reference Symbol
Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max
e D E
L
1
A A1
e
bp
e1
b c b c
p 3
e Z ( Ni/Pd/Au plating ) L
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
Reference Symbol
*2
c
Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c
0.00
0.10
0.20 2.20
0.34
0.40
0.46
0.15
1
0.20
0.25
A
c
HE
0 7.50 7.80 1.27
8 8.00
A1
y L
e x y
0.12 0.15 0.80 0.50
1
Detail F
Z L L 0.70 1.15
0.90
Rev.3.00, Jul.15.2005, page 6 of 7
HD74LS247
JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A Previous Code FP-16DNV MASS[Typ.] 0.15g
*1
D 9
F
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
Index mark
*2
E
HE
c
Reference Symbol
Dimension in Millimeters Min Nom 9.90 3.95 Max 10.30
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
D E A2
8 bp x M L1
A1 A bp b1 c c
1
0.10
0.14
0.25 1.75
0.34
0.40
0.46
0.15
0.20
0.25
HE
0 5.80 6.10 1.27
8 6.20
A
A1
L y
e x y
0.25 0.15 0.635 0.40
1
Detail F
Z L L 0.60 1.08
1.27
Rev.3.00, Jul.15.2005, page 7 of 7
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0


▲Up To Search▲   

 
Price & Availability of HD74LS247FPEL

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X